The aim of this study was to evaluate the physical-chemical changes in orthodontic devices made with laser and silver solder after immersion in different antiseptic solutions.

Wire/band assemblies were fabricated using different types of solders (silver and laser). The devices were immersed in different antimicrobial solutions (chlorhexidine – CHX 0.12% and Silver nanoparticles – NAg 0.12% and 0.18%). Non-immersion in solution and immersion in artificial saliva were used as initial and negative control, respectively (n=12). Surface morphological analysis was performed using Scanning Electron Microscopy (SEM). The quantitative analysis of the chemical elements present after the immersions in the solutions was analysed by Energy Dispersive X-ray Spectroscopy (EDS). The data were subjected to the Kruskal-Wallis test followed by Bonferroni, with a significance level of 5%.

Greater amounts of copper, silver and zinc were released from silver soldering, on the other hand, iron, nickel, and chromium ions were the most prevalent metal ions in laser soldering. Regarding mouthwashes, the lowest amounts of metal ions were released in CHX, and the highest amounts of ions were released in the 0.12% NAg and 0.18% NAg solutions.

Laser welding seems to be less susceptible to corrosion. The different antiseptic solutions did not contribute to an increase in ion release.